CLEANER MSP-H
Pretreatment for Electroless Copper Plating
C.Uyemura & Co., Ltd.
Product Overview
General Name
Pretreatment for Electroless Copper Plating
Product / Grade Name
CLEANER MSP-H
Maker Name
C.Uyemura & Co., Ltd.
Function(s)
- Surface Treatment > Cleaner
- Surface Treatment > Electroless Plating
End Use(s)
- Medical & Healthcare Products > Electroless Plating Solution
- Conditioning Agent
Feature(s)
- For SAP
- For MSAP
Hazard Classification
UN Number
:1993
IMGD Class
:3
Packing Group
:Ⅱ
HS Code
3824.9