CLEANER MSP-H
Pretreatment for Electroless Copper Plating
C.Uyemura & Co., Ltd.
Product Overview
General Name
Pretreatment for Electroless Copper Plating
Product / Grade Name
CLEANER MSP-H
Maker Name
C.Uyemura & Co., Ltd.
Function(s)
- Catalysts > Electroless Plating
- Cleaning Agents > Cleaner
- Environmental Solutions > Cleaner
- Functional Materials > Electroless Plating
- Surface Treatment > Cleaner
- Surface Treatment > Electroless Plating
End Use(s)
- Automotive Products > Electroless Plating Solution
- Coatings > Electroless Plating Solution
- Consumer Goods > Conditioning Agent
- Cosmetics & Personal Care > Conditioning Agent
- Electronics > Electroless Plating Solution
- Medical & Healthcare Products > Conditioning Agent
- Medical & Healthcare Products > Electroless Plating Solution
- Water Treatment Solutions > Conditioning Agent
Feature(s)
- For MSAP
- For SAP
Hazard Classification
UN Number
:1993
IMGD Class
:3
Packing Group
:Ⅱ
Commonly Used H.S. Code
3824.9