EPITHAS EDL
Electrolytic Copper Plating Additive for Wafer
C.Uyemura & Co., Ltd.
Product Overview
General Name
Electrolytic Copper Plating Additive for Wafer
Product / Grade Name
EPITHAS EDL
Maker Name
C.Uyemura & Co., Ltd.
Function(s)
- Cleaning Agents > Metal Finishing Agent
- Functional Materials > Metal Finishing Agent
- Electrolytic Copper Plating
- Surface Treatment > Metal Finishing Agent
End Use(s)
- Electronics > Semiconductor Material
- copper
Feature(s)
- Excellent Film Thickness
- For Fine Patterns
Hazard Classification
UN Number
:IMGD Class
:Packing Group
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