EPITHAS EPT
Electrolytic Copper Plating Additive for Wafer
C.Uyemura & Co., Ltd.
Product Overview
General Name
Electrolytic Copper Plating Additive for Wafer
Product / Grade Name
EPITHAS EPT
Maker Name
C.Uyemura & Co., Ltd.
Function(s)
- Surface Treatment > Metal Finishing Agent
- Electrolytic Copper Plating
End Use(s)
- copper
- Electronics > Semiconductor Material
Feature(s)
- High Speed Performance
- Easy Processing
Hazard Classification
UN Number
:IMGD Class
:Packing Group
: