EPITHAS EPT
Electrolytic Copper Plating Additive for Wafer
C.Uyemura & Co., Ltd.
Product Overview
General Name
Electrolytic Copper Plating Additive for Wafer
Product / Grade Name
EPITHAS EPT
Maker Name
C.Uyemura & Co., Ltd.
Function(s)
- Cleaning Agents > Metal Finishing Agent
- Functional Materials > Metal Finishing Agent
- Electrolytic Copper Plating
- Surface Treatment > Metal Finishing Agent
End Use(s)
- Electronics > Semiconductor Material
- copper
Feature(s)
- Easy Processing
- High Speed Performance
Hazard Classification
UN Number
:IMGD Class
:Packing Group
: