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Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony

Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony

Solder Paste (Pb-Free Solder Paste)

Harima Chemicals Group, Inc.

Product Overview

General Name

Solder Paste (Pb-Free Solder Paste)

Product / Grade Name

Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony

Maker Name

Harima Chemicals Group, Inc.

Function(s)

  • Surface Treatment  >  Pb Free Solder Paste

End Use(s)

  • Electronic Materials
  • Electronics  >  Solder

Feature(s)

  • Automotive Use
  • High Durability, Atmospheric Reflow

Hazard Classification

  • UN Number

    :

  • IMGD Class

    :

  • Packing Group

    :

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Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony

Solder Paste (Pb-Free Solder Paste)

Harima Chemicals Group, Inc.