PMER P-CS
Bump Formation Resist For Photobumping
Tokyo Ohka Kogyo Co., Ltd.
Product Overview
General Name
Bump Formation Resist For Photobumping
Product / Grade Name
PMER P-CS
Maker Name
Tokyo Ohka Kogyo Co., Ltd.
Function(s)
- Functional Materials > Photoresist
- Surface Treatment > Photoresist
End Use(s)
- Photobumping
- Precious Metal Plating Processes
Feature(s)
- Fine Gold Plating
- High Resistance to Metal Plating Solutions
Hazard Classification
UN Number
:IMGD Class
:Packing Group
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