Glicoat-SMD EX
Organic Solderability Preservative
Produced by Shikoku Chemicals Corporation
Glicoat-SMD F2
Glicoat-SMD F2(LX)
Glicoat-SMD F2(LX)PK
Glicoat-SMD F3
Glicoat-SMD F3PLUS
Glicoat T
HiREM-1
Cationic Fast Curing Monomer
L-DAIC
Low-dielectric Resin Cross-linker
MS-1
Multifunctional Thiol Epoxy Resin Curing and Cross-kinking Agents
P-DAIC
Low-Dielectric, Flame-Retardant Cross-Linker
ReX-2
High Refractive Index Materials
ReX-3
ReX-4
TA-G
THEIC-EP
Heat-resistant Multifunctional Polyol
THEIC-LD
TS-G
Multifunctional Thiol Epoxy Resin Curing and Cross-linking Agents
VD-5
VP-1 (Under Development)
Low dielectric flame retardant crosslinking agent
TETRAD C
1,3-Bis(N,N-Diglycidyl Aminomethyl)Cyclohexane
Produced by Mitsubishi Gas Chemical Company, Inc.
In steel drum of 180 kg net
Neopentylglycol 90%
2,2-Dimethyl-1,3-Propanediol
2-Ethylhexyl Methacrylate 99%
2-Ethylhexyl Methacrylate
2-Hydroxyethyl Methacrylate
2-Hydroxyethyl Methacrylate 97%
2-Hydroxyisobutyric Acid Methyl Ester 99.5%
2-Hydroxyisobutyric Acid Methyl Ester
Allyl Methacrylate 98%
Allyl Methacrylate
Benzyl Methacrylate 98%
Benzyl Methacrylate
CYTESTER P 201 R&D Grade
Cyanate Ester Monomer
CYTESTER TA-100 R&D Grade
1801–1830 of 8803 results
