TCM
Low-Expansion Glass Ceramic
Produced by Okamoto Glass Co., Ltd.
TC-S01A
Thermal Conductive Sheet for IC Chip Packaging
Produced by Resonac Corporation
TD-002
PWB(Printed Wiring Board) Material
TD-2090-60M
Novolac Phenol Resin for Curing Agent
Produced by DIC Corporation
TD-2093-60M
TDUR-P3435
Positive Krf Resist for Lines
Produced by Tokyo Ohka Kogyo Co., Ltd.
TDUR-P4197T PM
Positive Krf Resist for Holes
TDUR-P802
Krf Positive Wet Etching Photoresist Resist
TDUR-P9001 CO
Thick Film Krf Resist
TE
Polyurethane Catalysts
Produced by Tosoh Corporation
In can of 13 kg. net
In pail can of 15 kg. net
In drum of 150 kg. net
Tefabloc CP
Amorphous Polyolefin
Produced by Mitsubishi Chemical Corporation
Teflon EJ-CL500
Waterborne Top Coating
Produced by Chemours-Mitsui Fluoroproducts Co., Ltd.
Teflon EJ-CL700
Teflon EJ-GN500
Teflon EJ-GN700
Teflon EJ-GY700
Teflon MJ-102
Powder-Based Top Coating
Teflon MJ-103
Teflon MJ-310
Teflon MJ-501
Teflon MJ-502
Teflon MJ-600
Teflon MJ-610
Teflon MJ-614
Teflon MJ-620
Teflon MJ-622
Teflon MJ-623
Teflon MJ-624
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