X-92-248
Silicone Pressure Sensitive Adhesive for Adhesive
Produced by Shin-Etsu Chemical Co., Ltd.
Boron Trifluoride Phenol
Produced by Stella Chemifa Corporation
In chemical drum of 200 kg net
PEO PEO-15P
Polyethylene Glycol
Produced by Sumitomo Seika Chemicals Co., Ltd.
PEO PEO-18P
PEO PEO-1P
PEO PEO-27P
PEO PEO-3P
PEO PEO-8P
AQUPAANA AP-40F
Adhesive Base Materials for Poultices/Cooling Sheets/Face Masks
20 kg net
AQUPAANA AP-50
AQUPAANA AP-70
SEPOLEX-CSM-N
Resin Modifier
3-Bromophenylsulfur Pentafluoride
Produced by UBE Corporation
ETERNACOLL OXIPA
Bis[(3-Ethyl-3-Oxetanyl)Methyl]Isophtalate
UBE NYLON 1013IU50
Polyamide ６
UPILEX 125RN
Polyimide
UPILEX 20VT
UPILEX 25VT
UPILEX 50VT
ETERNACOLL Self-crosslinking
Polyurethane
δ-Valerolactone
THEIC-G
Tris(2-Hydroxyethyl) Isocyanurate
Produced by Shikoku Chemicals Corporation
THEIC-PW
Benzoxazine ALP-d
Low-dielectric Bismaleimide (BMI) Resin Cross-linkerBenzoxazine
Benzoxazine F-a
Benzoxazine P-d
C3TS-G
Multifunctional Thiol Epoxy Resin Curing and Cross-linking Agents
CUREDUCT™
Adduct Type Latent Curing Agent for Epoxy Resin
CUREZOL®︎ 1.2DMZ
Imidazole Type Curing Agent for Epoxy Resin
CUREZOL®︎ 1B2MZ
301–330 of 2512 results
