Search Results for "Functional Materials"

Nonionicity Polyacrylamide 20%

Surface Paper Power Enhancers

Produced by Harima Chemicals Group, Inc.

NPG-J

Nanopaste (NPS:Silver, NPG:Gold)

Produced by Harima Chemicals Group, Inc.

NPS-L

Nanopaste (NPS:Silver, NPG:Gold)

Produced by Harima Chemicals Group, Inc.

NPS-L-HB

Nanopaste (NPS:Silver, NPG:Gold)

Produced by Harima Chemicals Group, Inc.

Rosin Based Emulsions/50% Solids

Rosin-Based Emulsions

Produced by Harima Chemicals Group, Inc.

Rosin Based Emulsions/55% Solids

Rosin-Based Emulsions

Produced by Harima Chemicals Group, Inc.

Rosin Ester

Produced by Harima Chemicals Group, Inc.

Rosin-modified Pentaerythritol Ester

Rosin Ester

Produced by Harima Chemicals Group, Inc.

Rosin-modified Phenolic Resin

Rosin-Modified Phenolic Resin

Produced by Harima Chemicals Group, Inc.

Rosin-modified Special Synthetic Resin

Rosin Ester

Produced by Harima Chemicals Group, Inc.

SHB-200

Conductive Silver Paste

Produced by Harima Chemicals Group, Inc.

Special Denaturation Amphoteric Polyacrylic Amide

Dip Yield Improver

Produced by Harima Chemicals Group, Inc.

Special Modified Rosin

Modified Rosin/Modified Rosin Ester

Produced by Harima Chemicals Group, Inc.

Special Modified Rosin (Emulsion) 50%

Rosin Emulsion Size Agent

Produced by Harima Chemicals Group, Inc.

Special Rosin Resin

Rosin Ester

Produced by Harima Chemicals Group, Inc.

ST-200

Conductive Silver Paste

Produced by Harima Chemicals Group, Inc.

Synthetic Polymers (Anion) 35%

Barrier Coating Agent

Produced by Harima Chemicals Group, Inc.

Synthetic Polymer Systems (Anion) 20%

Surface Sizing Agent

Produced by Harima Chemicals Group, Inc.

Synthetic Polymer Systems (Anion) 25%

Surface Sizing Agent

Produced by Harima Chemicals Group, Inc.

Synthetic Polymer Systems (Cation) 20%

Synthetic Sizing Agent

Produced by Harima Chemicals Group, Inc.

Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony

Solder Paste (Pb-Free Solder Paste)

Produced by Harima Chemicals Group, Inc.

Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony -Nickel -Cobalt

Solder Paste (Pb-Free Solder Paste)

Produced by Harima Chemicals Group, Inc.

Tin-3% Silver-0.5% Copper

Solder Paste (Pb-Free Solder Paste)

Produced by Harima Chemicals Group, Inc.

Tin-58% Bismuth

Solder Paste (Pb-Free Solder Paste)

Produced by Harima Chemicals Group, Inc.

Titanium Dioxide 10%

Nanoparticle Dispersion (Developed Product Water Dispersion Type)

Produced by Harima Chemicals Group, Inc.

Titanium Dioxide 25%

Nanoparticle Dispersion (Under Development/Solvent Type)

Produced by Harima Chemicals Group, Inc.

Wax (Emulsion) 30%

Callender Form Release Agent

Produced by Harima Chemicals Group, Inc.

Zinc Oxide 20%

Nanoparticle Dispersion (Under Development/Solvent Type)

Produced by Harima Chemicals Group, Inc.

Zirconium Dioxide 10%

Nanoparticle Dispersion (Developed Product Water Dispersion Type)

Produced by Harima Chemicals Group, Inc.

Zirconium Dioxide 25%

Nanoparticle Dispersion (Under Development/Solvent Type)

Produced by Harima Chemicals Group, Inc.