ST-200
Conductive Silver Paste
Produced by Harima Chemicals Group, Inc.
Synthetic Polymers (Anion) 35%
Barrier Coating Agent
Synthetic Polymer Systems (Anion) 20%
Surface Sizing Agent
Synthetic Polymer Systems (Anion) 25%
Synthetic Polymer Systems (Cation) 20%
Synthetic Sizing Agent
Tall Oil Fatty Acid 87.5%
Tall Oil Fatty Acids and Tall Rosin
In drum of 190 kg net
Tall Oil Fatty Acid 93.5%
Tall Oil Fatty Acid 96.5%
Tall Oil Fatty Acids
Alkyd Resin
Tall Oil Fatty Acids/50%
Tall Oil Fatty Acids Imidazoline
Tall Oil Derivative
In drum of 180 kg net
Thermoplastic Polyamide Resin
Polyamide Resin
Tin-3.0% Silver-0.5% Copper
Solder Paste (Pb-Free Solder Paste)
Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony
Tin-3.2% Silver-0.5% Copper-4.0% Bismuth-3.5% Antimony -Nickel -Cobalt
Tin-3% Silver-0.5% Copper
Tin-58% Bismuth
Titanium Dioxide 10%
Nanoparticle Dispersion (Developed Product Water Dispersion Type)
Titanium Dioxide 25%
Nanoparticle Dispersion (Under Development/Solvent Type)
Toll Rosin
In drum of 228 kg net
Wax (Emulsion) 30%
Callender Form Release Agent
Wax Special Nonionic Surfactant
Defoamer
Zinc Oxide 20%
Zirconium Dioxide 10%
Zirconium Dioxide 25%
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